Unlock Your Future in Engineering
Scholarship Overview
Partial Funding for International Students
- Host Country: Japan
- Institution: Leading Japanese Universities
- Degree Level: PhD
- Field of Study: Engineering
- Deadline: December 10, 2024
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Are you ready to transform your academic journey and achieve your goals in science, technology, and innovation? The 2025 Human Resources Development in Science, Technology, and Innovation (STI) Scholarship by AUN/SEED-Net offers an exceptional opportunity to pursue a PhD in engineering at prestigious Japanese universities.
About AUN/SEED-Net
The ASEAN University Network/Southeast Asia Engineering Education Development Network (AUN/SEED-Net) was established in 2001 with the support of the Japan International Cooperation Agency (JICA). This initiative fosters collaboration between universities in Southeast Asia and Japan, aiming to:
- Enhance engineering education quality.
- Develop human resources in science and technology.
- Promote regional cooperation for sustainable development.
AUN/SEED-Net supports these goals through scholarships, research funding, and networking opportunities for innovative capacity-building.
Available Subjects
The scholarship supports PhD programs in 10 engineering disciplines, including:
- Chemical Engineering
- Civil Engineering
- Computer and Information Engineering
- Electrical and Electronics Engineering
- Geological and Geo-Resource Engineering
- Materials Engineering
- Mechanical and Manufacturing Engineering
- Energy Engineering
- Environmental Engineering
- Natural Disaster
Benefits of the Scholarship
1. Comprehensive Financial Support
Covers tuition fees, books, and other educational expenses, enabling you to focus entirely on your studies.
2. Prestigious Recognition
Being selected for this scholarship showcases your academic excellence and potential, strengthening your resume and career prospects.
3. Access to Exclusive Academic Resources
Benefit from mentorship programs, international events, and a robust academic network to elevate your educational experience.
4. Investment in Your Future
Beyond financial aid, this scholarship is a strategic boost for personal and professional growth, preparing you to lead in innovation and technology.
Eligible Nationalities
Applicants must be citizens of ASEAN countries:
- Vietnam
- Cambodia
- Laos
- Malaysia
- Thailand
- The Philippines
- Indonesia
Eligibility Criteria
To qualify, applicants must:
- Be faculty members or outstanding students from AUN/SEED-Net Member Institutions (MIs) in ASEAN countries.
- Be under 35 years of age at the time of arrival in Japan.
- Hold a Master’s degree in a relevant engineering field or be on track to obtain it before departure.
- Demonstrate strong English proficiency (TOEFL/IELTS scores recommended).
- Be in good health to undertake the program.
- Not hold other scholarships during the application period.
Application Procedure
Follow these steps to apply:
1. Prepare Required Documents
Submit the following documents to [email protected] by November 28, 2024 (11:59 WIB):
- Academic transcripts (Bachelor’s and Master’s) in English.
- English proficiency test certificate (TOEFL/IELTS).
- Completed Statement Letter (download template from the official website).
2. Complete the Online Application
Submit your online application by December 10, 2024, following the provided guidelines.
3. Nomination and Shortlisting
- Internal Selection by IRO: November 28 – December 10, 2024.
- Shortlisting by Japanese Universities: December 25, 2024 – March 2025.
4. Final Preparations
- Complete admission formalities.
- Apply for the JICA Knowledge Co-Creation Program (KCCP).
- Prepare for orientation and enrollment.
Key Deadlines
Milestone | Date |
---|---|
Document Submission to IRO | November 28, 2024 |
Online Application Deadline | December 10, 2024 |
University Shortlisting Period | December 25, 2024 – March 2025 |
Start Your Journey Today
The AUN/SEED-Net Scholarship is more than financial aid—it’s your gateway to academic and professional excellence. Don’t miss this life-changing opportunity. Prepare your application now and take the first step toward a future in science, technology, and innovation.