Scholarship Description:
Donghua University is offering Scholarships with support of Shanghai Government for international students. Each year, DHU accepts about 40 Shanghai Government Scholarship students from all over the world to pursue undergraduate (bachelor’s) or postgraduate (master’s or doctoral) degrees.
University:
Donghua University, Shanghai China.
Degree level:
Undergraduates and Post Graduates.
Field of Study:
Chinese-taught Bachelor’s Programs (except B.A. in Chinese Language)
Master’s degree programs except International Business (MIB)
Doctoral degree programs
Scholarship Award:
Full Scholarship (Type A):
- Tuition fee waiver.
- Free on-campus dormitory accommodation.
- Monthly stipend (bachelor’s programs: 2500; master’s programs: CNY 3000; doctoral programs: CNY3500).
- Comprehensive Medical Insurance and Protection Scheme for International Students in China.
Partial Scholarship (Type B):
- Waiver of tuition fee.
- Comprehensive Medical Insurance and Protection Scheme for International Students in China.
Nationalities:
International Students.
Eligibility Criteria:
Be a non-Chinese citizen in good health.
Master’s degree holder under the age of 40 when applying for doctoral programs.
Bachelor’s degree holder under the age of 35 when applying for master’s programs.
High school graduate under the age of 25 when apply for bachelor’s programs
Excellent in academic and extra-curricular performance and yet not be rewarded any other scholarships offered by government, institutes or organizations in China.
Applying procedure Instructions:
Apply directly to DHU:
- Check if DHU offers the academic program you plan to learn, as well as whether it is covered by SGS scholarships or not.
- One can complete SGS online application at http://study.edu.sh.gov.cn in order to save your information in the scholarships application database, before you apply to DHU.
- Then, complete the following steps to accomplish your application to DHU: 1). Fill DHU’s online application 2). Submit the hard copies of the complete application materials required, and 3). Pay the application fee.
Apply Now
Application Deadline: 31 March 2021
